Design of Very Low Return Loss, Rectangular Microstrip Patch Antenna for Cellular and Mobile Communication
Hemant Kumar Gupta 1, Bhupesh Gautem 1,
Poonam Sinha 2, and
Abha Soni 2
1. Bethesda Institute of Technology&Science, Department of Electronics, Gwalior (M.P)-INDIA
2. Department of Electronic Barkatullah university of Technology Bhopal (M.P)-INDIA
2. Department of Electronic Barkatullah university of Technology Bhopal (M.P)-INDIA
Abstract—Cellular Mobile Communication is need of world. In this era life cannot imagine without cell phone. In this paper it has been designed a two antenna for GSM communication at 1800MHz. First antenna is Rectangular Microstrip Patch Antenna(RMPA), and second one is Slit Slotted Rectangular Microstrip Patch Antenna(SSRMPA). Basic property of both the antenna like simulated design, Returnloss, Electric field Distribution, Radiation Pattern are discussed. Finally it is shown that Return Loss of Antenna in Slit-Slot Patch is decreased about 92.52%, and antenna Directivity is also increased a bit, and Total Efficiency of slit-slot RMPA is increased about 12.48% Slit-Slot Rectangular Microstrip Patch Antenna also Reduces the size of antenna which is always a basic need of cell phone antenna design system. Slit Slotted RMPA also improving the result by lowering the return loss at 92.52% almost all losses removed.
index terms—Rectangular Microstrip Patch Antenna (RMPA), Slit-Slot Rectangular Microstrip Patch Antenna (SSRMPA), returnloss, directivity
Cite: Hemant Kumar Gupta, Bhupesh Gautem, Poonam Sinha, and Abha Soni, "Design of Very Low Return Loss, Rectangular Microstrip Patch Antenna for Cellular and Mobile Communication," International Journal of Electronics and Electrical Engineering, vol. 1, no. 3, pp. 195-198, September 2013. doi: 10.12720/ijeee.1.3.195-198
Cite: Hemant Kumar Gupta, Bhupesh Gautem, Poonam Sinha, and Abha Soni, "Design of Very Low Return Loss, Rectangular Microstrip Patch Antenna for Cellular and Mobile Communication," International Journal of Electronics and Electrical Engineering, vol. 1, no. 3, pp. 195-198, September 2013. doi: 10.12720/ijeee.1.3.195-198
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