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Experimental Study for Effects of Cost-Fewer Nanoparticles on Dielectric Performance of Polypropylene Nanocomposites

Ahmed Thabet
Nano-Technology Research Centre, Aswan University, 81528, Egypt
Abstract—In this study, the enhancement of dielectric characterization has been investigated on Polypropylene (PP) as matrix that highly modified by presence of costless nanofillers clay and fumed silica. And so, dielectric strength of nanocomposites has been improved significantly with respect to unfilled materials under high voltage alternating current (HVAC) electric fields. Filling nanoparticles into polymers provide advantages over unfilled polymers because they increasing resistance to degradation according to their types and concentrations. Therefore, an experimental work for dielectric loss and capacitance of the new polypropylene nanocomposite materials have been investigated and compared with unfilled polypropylene industrial materials. A simplified HVAC breakdown model test has been used for experimental tests and measurements; whatever, the rate of dielectric strength of tested nanocomposite materials precedes the conventional polypropylene insulation materials under AC electric fields. Therefore, the dielectric strength is measured for several new polypropylene nanocomposite specimens. These experimental measurements depict that the incorporation of clay or fumed silica nanoparticles into Polypropylene (PP) has been controlled the dielectric strength and voltage endurance significantly compared to conventional materials with respect to their types and concentrations. Finally, a thermal effect on suggested nanocomposites under uniform and non-uniform electric fields has been analyzed that encourage industrial fabrication production for the suggested cost-fewer nanoparticles.
 
Index Terms—dielectric strength, nanocomposite, nanoparticles, polypropylene, insulation

Cite: Ahmed Thabet, "Experimental Study for Effects of Cost-Fewer Nanoparticles on Dielectric Performance of Polypropylene Nanocomposites," International Journal of Electronics and Electrical Engineering, Vol. 4, No. 2, pp. 134-139, April 2016. doi: 10.18178/ijeee.4.2.134-139
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